Composition ( mass% )
|
||
Ag
|
Cu
|
Sn
|
3.0 ± 0.1
|
0.50 ± 0.05
|
Balance
|
Items
|
Performance Standard
|
Test Method
|
Appearance
|
It shall not have separated flux,and shall be in a smooth pastestate.
|
STM-1
|
Flux content (mass%)
|
11.5 ± 1.0
|
STM-5
|
Viscosity of solderpaste (Pa s)
|
190 ± 30
|
STM-7-8
|
Grain size of powder
(um)
|
36 ~25
|
STM-12-4
|
Copper plate corrosion test
|
Shall be passed
|
STM-28-1
|
Insulation resistance
|
Ordinary state 1 × 10 or more After humidifying 1 × 10 or more
|
STM-30-8
|
Solution resistance
|
100 or more
|
STM-32
|
Reflow property
|
No unmelted solder nor black product shall be permissibl
|
STM-34
|